Thermodynamics of Atomic Layer Etching Chemistry on Copper and Nickel Surfaces from First Principles

نویسندگان

چکیده

Plasma-thermal atomic layer etching is a promising technique to enable selective and directional on metals. It involves plasma activation step thermal where etchant molecules remove fraction of the surface. To accelerate process development, computational model for thermodynamics removal highly desirable. An energy expression developed here calculate an activated slab structure. The approach samples configurations metal surfaces determines thermodynamic balance each obtained configuration. heterogeneity surface terminations treated by equilibrium crystal shape method. models are put test with combinations two modifiers (O N), substrates (Cu Ni), etchants (formic acid formamidine). found that higher coverages lead more favorable etching. In addition, our results show energies vary among different terminations, differences order 0.5 eV. This suggests can preferentially occur over certain terminations. Qualitative agreement experiment Ni/O/formic system at high oxygen atoms.

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ژورنال

عنوان ژورنال: Chemistry of Materials

سال: 2021

ISSN: ['1520-5002', '0897-4756']

DOI: https://doi.org/10.1021/acs.chemmater.1c01324